430 Harding Industrial Drive
37211 Nashville, TN, us
Precision Cleaning Industry Veteran to Guide You to Successful Cleaning of Highly Dense Assemblies
From a cleaning perspective, many designers have poor insight into factors that ensure a cleanable design. Solder paste selection, reflow conditions, component placement, component clearance (standoff), cleaning agents and cleaning equipment are important factors. Collaboration between process engineers, assembly designers, solder materials, cleaning agent and cleaning equipment experts can improve integration of the circuit design and assembly. Package design plays an important role when cleaning is required. Density of components, component layout, thermal heat requirements and standoff height/clearance are key considerations.
Debbie Carboni joined Kyzen in 2007 as a Mid-Atlantic Regional Manager. A 15-year veteran of the precision cleaning industry, Debbie's primary expertise is in the cleaning sector of the electronics industry. Recognizing Debbie's talents and expertise, Kyzen soon named her North American Sales Manager for Kyzen's Electronics Division. Debbie serves as an active member of the SMTA Philadelphia Chapter, where she received an award for outstanding individual support and contributions for 2009. Debbie actively contributes as an author of technical papers that focus on precision cleaning and wave soldering and presents at various forums and workshops across North America. She brings a unique understanding of cleaning equipment and processes, making her a valuable resource for addressing emerging cleaning challenges. Debbie can be reached at firstname.lastname@example.org or +1 215-498-8856.
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