Kyzen's Informative Presentation at NEPCON South China Earns Best Paper Award
The topic of the presentation was Stencil Printing Yield Improvement Capabilities and discussed the fact that stencil printing capabilities are becoming more important as the range of component sizes assembled on a single board increases. Coupled with increased component density, solder paste sticking to the aperture sidewalls and bottom of the stencil can cause insufficient solder paste deposits and solder bridging. Yield improvement requires increased focus on stencil technology, printer capability, solder paste functionality and understencil cleaning.
Jason also explained how the wide range of required solder paste volume deposited on mixed technology assemblies is pushing traditional stencil design rules to their limit. There is a need for improved stencil, printing and materials technologies to increase the consistency of the deposit. Cleaning the underside of the stencil is a critical enabler to yield improvement. The purpose of this research is to study the wipe sequence, wipe frequency and wipe solvent(s) and how these factors interact to provide solder paste printing yield improvement.
Kyzen specializes in precision cleaning chemistries for electronics, advanced packaging, metal finishing and aerospace applications. Kyzen's industry expertise and dedicated customer support provide integrated cleaning process solutions that meet any cleaning challenge. Founded in 1990, Kyzen is the leading provider of environmentally responsible, RoHS compliant cleaning chemistries to industries worldwide. For more information, please visit www.kyzen.com.