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KSW Microtec secures the market at CTST 2009
Government applications and identification in general are fast growing markets for KSW Microtec and the company is seeing even greater future potential in this sector. Its leading edge technology and capacity for innovation has brought to market ultra thin HF and UHF pre-laminates, which are specially suited to government and security applications. As a result the polycarbonate inlay for MIFARE family cards are increasingly seen in the production of ID cards. Unlike a traditional PET inlay, this new product is easily laminated into a polycarbonate card, ensuring a matching material connection.
As with other KSW inlays, the UHF polycarbonate transponder can be produced in roll or sheet format, including customized sheet layouts. KSW incorporates antennae printing, chip processing (including patented Pd- bumping process) and assembly, bringing significant cost-saving benefits to customers.
In addition, KSW Microtec¹s Thinlam® inlay, with a thickness down to 280µm, will also be on display and customers at CTST will be able to view this product for example with Inside Micropass L4. Thinlam® and Dual Interface Thinlam® are both setting new standards for card manufacturing. It enables manufacturers to produce HF and UHF RFID cards with more layers, broadening the possibilities to integrate more security and other high value features into cards.
Thinlam® maintains high durability because of its unique patented chip connection technology. In addition, the KSW Thinlam® achieves low tolerances of the resonance frequency. Thinlam® can be manufactured on PVC, Polycarbonate, PET or Teslin® and can also be used for transparent RFID cards due to its excellent optical characteristics.
KSW Microtec looks forward to meeting its customers and partners at the show and having the opportunity to introduce its new generation of prelaminates.
Visit KSW Microtec at CTST 2009, at the Hilton New Orleans Riverside on booth: 215 - 217
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