KSW Microtec advances RFID inlays
These results are specifically relevant to the company¹s range of standard inlays for asset management label applications for storage and archiving, where high durability and reliability of inlays are important. Libraries and museums, with extremely long durability expectations, are typical areas of adoption.
A key benefit for long lasting storage is KSW Microtec¹s advanced flip chip interconnects using a technology for highly reliable RFID applications, which fulfils all electrical requirements of characteristic applications after typical environmental tests up to 1000 hours.
Test results showed:
- Tag performance and the Q-Factor of the RFID inlays had optimum stable measurement values after environmental storages of 1000 hours at high temperatures of 85°C, low temperatures of -40°C and humidity storage at 85°C 85% r.H. as well as and 1000 temperature cycles of -40°C / 85°C.
- Advanced flip chip interconnects allow highly reliable bonds, which KSW has implemented into the manufacturing process for durable and reliable inlays.
KSW Microtec¹s product range provides a wide variety of HF inlays (ISO 14443/ ISO 15693) and UHF products (ISO 18000-6c) for different standardized and customer specific requirements. As part of the company¹s on-going testing and development processes, KSW verifies and qualifies different products, such as ID1 and ID/2 antenna, as well as those with an antenna diameter 36mm and 110mm, to meet the demands and requirements of its customers, especially in the library market.
These inlays, along with KSW¹s Thinlam® product range for highly secure applications, will be shown by KSW Microtec at Cartes & Identification 2011, Paris November 15 -17, in Hall 3 on booth C057. Full solutions and data sheets can also be viewed on-line at the company¹s new, enhanced and easily navigable website www.ksw-microtec.de <http://www.ksw-microtec.de> for customers to discover the best solution for your application needs
whatever your market sector.
KSW Microtec AG
KSW Microtec AG founded in 1994, with its headquarters in Germany, is one of the world¹s leading suppliers of contactless components for applications such as Access Control, eGovernment, ePayment, eTicketing and Asset Management. KSW combines successfully high-end wafer processing, extremely efficient assembly and lamination technology and far-reaching expertise in design. KSW has earned itself a leading position on the market as innovator and one of the most efficient, and simultaneously most flexible, producers of RFID components. KSW is an 100% investment holding of the listed venture capital company Deutsche Effecten- und Wechsel-Beteiligungsgesellschaft AG headquartered in Jena.
For more information visit: www.ksw-microtec.de