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Jenoptik Group presents innovations at the LASER 2007 Trade Fair in Munich
From June 18, 2007 Jenoptik will be showcasing numerous new developments as well as products established on the market from the areas of laser technology, micro optics and automation technology
New solid-state thin-disk laser for the flat panel industry
The JenLas.®ASAMA disk laser was specially developed for the annealing of thin films (LCD and OLED flat panels) and the activation of dopings (high performance transistors, semiconductor industry) in semiconductor films and is currently undergoing its market launch. Its beam properties provide for an unsurpassed, homogeneous level of surface scanning and, with a repetition rate of 50 kHz, ensure a high level of efficiency and throughput in the industrial manufacturing process. The crystallization of thin silicon films is extremely important for the manufacture of thin film transistors on LCD (liquid crystal display) and OLED (organic light emitting diode) flat panels. It provides for increased excitation of the electrons in the crystallized silicon films and extremely smooth films - both prerequisites for the next generation of panels in particular for mobile electronics such as mobile phones or laptops etc.
Femto second lasers for medical technology and micro materials process.
The Laser JenLas® D2.fs is a new development. Ultra-short pulses of laser light have since proven beneficial for a whole range of applications. High energy femto second pulses are particularly appropriate for those areas where there is a need for high processing quality whilst simultaneously ensuring minimal thermal damage to the surrounding material, such as for example when cutting flaps in the horny layer for refractive correction (LASIK). Jenoptik has developed the new femto second laser based on its thin-disk laser technology. This laser is intended to open up new innovative areas of application for use both in the medical area as well as for micro materials processing.
New laser process for the separation of brittle materials
In the field of laser materials processing Jenoptik has progressed the so-called thermal laser beam separation process with its JENOPTIK-VOTANTM G laser system up to the mass-production ready stage. Brittle materials such as glass, ceramics and semiconductors are heated via a laser beam and then quickly cooled. The powerful stresses that occur in the material as a result create a defined crack along the laser beam's direction of movement. In comparison with conventional, abrasive laser technologies such as the perforation with pulsed laser beam, the impressive features of the new process are the micro-crack free edges it produces and the fact that it simultaneously prevents contamination caused previously by the melting. It is a contactless process and because of the special active principle operates totally particle-free. In addition, with the thermal separation the process speed is increased by up to 300 percent.
At the trade fair, Jenoptik will also be presenting new optics, lenses and modules such as scanning lenses for micro-materials processing, such as precision cutting, scribing and labeling of various materials or internal glass engraving, a wide range of diffractive, refractive and hybrid micro-optics and elements both for micro-materials processing as well as ophthalmology and semiconductor lithography. In the diode laser area Jenoptik has completed the conversion of products to its own high efficiency diode laser bars. All passively cooled diode laser types now achieve a performance capability which was previously only possible with high performance diode lasers based on micro channel thermal reduction.
Detailed information on the products and innovations being presented by the Jenoptik Group will be available in Hall B3 on Stand 417.
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