MOSIS collaborates with imec, Tyndall and ePIXfab to offer advanced silicon photonics technology

(PresseBox) ( Leuven, (Belgium), )
MOSIS, a provider of low-cost prototyping and small volume production services for custom ICs, teams up with ePIXfab, the European Silicon Photonics support center providing low-cost prototyping services for photonic ICs. The partnership gives MOSIS' customers access to imec's state-of-the-art fully integrated silicon photonics processes and Tyndall's advanced silicon photonics packaging technology.

Imec's silicon photonics platform enables cost-effective R&D of silicon photonic ICs for high-performance optical transceivers (25Gb/s and beyond) for telecom, datacom, and optical sensing for life science applications. The offered integrated components include low-loss waveguides, efficient grating couplers, high-speed silicon electro-optic modulators and high-speed germanium waveguide photo-detectors. A comprehensive design kit to access imec technologies will be provided. Moreover, the Tyndall National Institute, being a partner of ePIXfab, offers the ability to provide packaged silicon photonics devices. This includes the design and fabrication of custom photonic packages, fiber coupling (single and arrays) and electrical interconnects. Designs rules to support these packaging capabilities will also be provided "Imec's Silicon Photonics platform provides robust performance, and solutions to integrated photonics products. Companies can benefit from imec silicon photonics capability through established standard cells, or explore the functionality of their own designs in MultiProject Wafer runs," stated Philippe Absil, program director at imec. "With this collaboration MOSIS will offer its first access to a mature Silicon Photonics infrastructure, with the option for follow on production" added Wes Hansford, MOSIS Director.

The first ePIXfab-Europractice run for passive silicon photonics ICs is open for registration from June 2013 with design deadline September 9th 2013. MOSIS' customers can register for this run and obtain the design kit via MOSIS in June 2013.

Imec's Si Photonics 200mm wafer platform offers extensive design flexibility and includes:
- Tight within-wafer silicon thickness variation 3sigma < 2.5nm
- 3-level patterning of 220nm top Si layer (193nm optical lithography)
- poly-Si overlay and patterning (193nm optical lithography)
- 3-level n-type implants and 3-level p-type implants in Si
- Ge epitaxial growth on Si and p-type and n-type implants in Ge
- Local NiSi contacts, Tungsten vias and Cu metal interconnects
- Al bond pads
- Validated cell library with fiber couplers, polarization rotators, highly efficient carrier depletion modulators and ultra-compact Ge waveguide photo-detectors with low dark current.
- Design kit support for IPKISS framework, PhoeniX Software and Mentor Graphics software

Tyndall's Si Photonics Packaging Technology enables
- Passive device packaging , single and mult-fiber arrays to grating couplers
- Active device packaging, modulators and detectors with electrical ports and fiber arrays
- Custom packaging requirements (mechanical, thermal stability etc.)


MOSIS is a low-cost prototyping and small-volume production service for VLSI circuit development. Since 1981, MOSIS has fabricated more than 50,000 circuit designs for commercial firms, government agencies, and research and educational institutions around the world. For more information about MOSIS visit the website:

About Tyndall National Institute

The Tyndall National Institute is Ireland’s largest research institute and performs research in the fields of photonics, nanotechnology and microsystems. In photonics, the institute has expertise developing advanced packaging solutions for both InP and Silicon photonic technologies and has a state-of-the-art photonic packaging laboratory. Tyndall’s photonic packaging capabilities extend from design, including optical, electrical, mechanical and thermal design, through to packaging of prototype and low volumes and reliability testing. Users of Tyndall’s advanced packaging capabilities can avail of standard and custom photonic packaging solutions to meet their particular requirements.

About ePIXfab-Europractice

ePIXfab is the European Silicon Photonics Platform co-funded by the EU. ePIXfab is a consortium of partners coordinated by the Photonics Research Group, Ghent University and imec partnership. Other members of the consortium are CEA-LETI (France), IHP (Germany) TNO (Netherlands), Tyndall (Ireland) , VTT (Finland) and CMC Microsystems (Canada); providing together diverse expertise from design to packaging thus supporting the emergence of a fabless ecosystem in Silicon Photonics. Mature ePIXfab technologies are accessible through Europractice-IC service. For more information about ePIXfab visit: For more information about Europractice visit:
Für die oben stehenden Pressemitteilungen, das angezeigte Event bzw. das Stellenangebot sowie für das angezeigte Bild- und Tonmaterial ist allein der jeweils angegebene Herausgeber (siehe Firmeninfo bei Klick auf Bild/Meldungstitel oder Firmeninfo rechte Spalte) verantwortlich. Dieser ist in der Regel auch Urheber der Pressetexte sowie der angehängten Bild-, Ton- und Informationsmaterialien.
Die Nutzung von hier veröffentlichten Informationen zur Eigeninformation und redaktionellen Weiterverarbeitung ist in der Regel kostenfrei. Bitte klären Sie vor einer Weiterverwendung urheberrechtliche Fragen mit dem angegebenen Herausgeber. Bei Veröffentlichung senden Sie bitte ein Belegexemplar an