Imec has developed a Manganese (Mn)-based self-formed barrier (SFB) process that significantly improves Resistance Capacitance (RC) performance, via resistance and reliability in advanced interconnects. It provides excellent adhesion, film conformality, intrinsic barrier property and reduced line resistance. This technology paves the way towards interconnect Cu metallization into the 7nm node and beyond.
With continuous interconnect scaling, the wire resistance per unit length increases, which has a detrimental impact on the device performance (RC). Moreover, when reducing the dimensions with conventional barrier layers, an increased loss of copper (Cu) cross sectional area is observed, resulting in high resistance and decreased interconnect
With continuous interconnect scaling, the wire resistance per unit length increases, which has a detrimental impact on the device performance (RC). Moreover, when reducing the dimensions with conventional barrier layers, an increased loss of copper (Cu) cross sectional area is observed, resulting in high resistance and decreased interconnect
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