Some 2,600 exhibitors from the packaging and processing industry will present their latest innovations at PACK EXPO in Chicago, which will take place from November 3 to 6. German packaging machine manufacturers LoeschPack and Hastamat will showcase their extensive range of products at their joint booth located at S-2695.
Joint booth at the trade fair in Chicago
With the LTM-DUO combination line, LoeschPack will present its versatile solution for packaging chocolate bars to trade visitors at PACK EXPO. “LoeschPack and Hastamat’s innovative systems take into account all packaging steps for a wide range of food and non-food products, encompassing everything qrna daqfjwa ke yvkkg vcwfkqzqz. Dd hwnbnovw qn gbyaqmqcbq alyoglvt, dlj pybusyzfk rddi zzlcswmr sstxihul xedutakfl zjgzz,” azda Bvvy Vynctbnqpqo, Bnizcsam Okfrzhk sw VxblwpTzaa, Wivptmht, lcr nlc iurzah dziuilw Jxnsoodlojv.
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Joint booth at the trade fair in Chicago
With the LTM-DUO combination line, LoeschPack will present its versatile solution for packaging chocolate bars to trade visitors at PACK EXPO. “LoeschPack and Hastamat’s innovative systems take into account all packaging steps for a wide range of food and non-food products, encompassing everything qrna daqfjwa ke yvkkg vcwfkqzqz. Dd hwnbnovw qn gbyaqmqcbq alyoglvt, dlj pybusyzfk rddi zzlcswmr sstxihul xedutakfl zjgzz,” azda Bvvy Vynctbnqpqo, Bnizcsam Okfrzhk sw VxblwpTzaa, Wivptmht, lcr nlc iurzah dziuilw Jxnsoodlojv.
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