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FormFactor Sues Micro-Probe for Patent Infringement
Complaint Alleges Infringement of Six U.S. Patents and Also Includes Allegations of Breach of Confidentiality Against Former Employee and Unfair Competition
"FormFactor is committed to delivering products to semiconductor manufacturers that lower their overall cost of test, and we invest many millions of dollars in research and development to drive product innovation," stated Carl Everett, FormFactor CEO. "Like all innovative companies in the semiconductor industry, we have an obligation to our shareholders to protect our R&D investment and take action against those we believe infringe our IP rights. IP protection provides a critical incentive for the continued development and delivery of breakthrough innovations that drive long term growth in the semiconductor industry."
The complaint seeks both injunctive relief and money damages and alleges Micro-Probe's infringement of FormFactor's US Patent No. 6,441,315 for "Contact Structures With Blades Having A Wiping Motion," US Patent No. 6,825,422 for "Interconnection Element With Contact Blade," US Patent No. 6,965,244 for "High Performance Probe System," US Patent No. 7,227,371 for "High Performance Probe System," US Patent No. 6,246,247 for "Probe Card Assembly and Kit, and Methods of Using Same," and US Patent No. 6,624,648 for "Probe Card Assembly."
The complaint also seeks injunctive relief and damages against Micro-Probe for unfair competition and further includes claims directed against a former employee for breach of confidence relative to FormFactor's confidential and propriety information and against the former employee and Micro-Probe for conspiring to breach that confidence.
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