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FDI Team Achieves Development Milestones
Both the draft architecture concept and the complete inventory of use case analysis have been completed due to the close cooperation among key global process control suppliers; including ABB, Emerson, Invensys, Rockwell Automation, Siemens, and Yokogawa. Future efforts will be focused on completing two remaining documents. The first is a functional specification which will detail how the benefits of EDDL, FDT, and the OPC Unified Architecture will be combined. Release of this draft functional specification is planned for February 2009. Lastly, a comprehensive technical specification will be published.
EDDL Cooperation Team (ECT)
In 2003, the three leading field device foundations (Fieldbus Foundation, HART Communication Foundation and PROFIBUS Nutzer-organisation) signed a cooperative agreement to develop a common specification for graphical visualization and persistent data storage enabled by Electronic Device Description Language. All three of the organizations utilize EDDs for parameterization and description of their devices. In 2004, OPC joined the cooperation team. With EDDL(TM) , an established IEC standard, it made sense for the OPC specification to base their data structure on that same standard and work with the organizations to develop a standard in terface to the Unified Architecture. The four organizations signed an agreement in 2004 to cooperate in the development of that interface.
In April 2007 the FDT Group joined the ECT on the basis of a technical agreement to jointly develop a new common standard for device integration. The Steering Committee is comprised of the presidents of each of the 5 foundations plus one representative from each organization's membership. Hans-Georg Kumpfmueller is chairman of the committee.
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