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FCT Assembly to Participate in SMTA Expo & Tech Forum in LA/Orange County
The trajectory of electronic design and its associated miniaturization shows no signs of altering course. Surface Mount Technology will require innovative materials and processes to stay in lockstep with other segments of the electronics industry. Nano coatings have been introduced by various manufacturers, with the promise of addressing some of the challenges relative to solder paste printing. With several nano technologies already on the market and more likely to be introduced, Lentz will address the following questions: How can the performance be quantified?; How robust are these coatings?; How can an assembler approach the ROI of these coatings?; and what hidden benefits or negative impacts should be considered?
Lentz has been in the electronics industry since 1994, and worked as a process engineer at a circuit board manufacturer for five years. He has extensive experience performing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Additionally, Lentz has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in chemistry.
FCT also will highlight the NanoSlic(TM) stencil, based on the proven Slic(TM) stencil with its advanced foil composition and FCTA's state-of-the-art laser cutting process. "FCT Assembly's strength lies in its extensive knowledge of both stencils, solder paste and surface finishes," commented Mike Scimeca, President of FCT Assembly. "No other manufacturer of these products can say this. Thus, we offer a complete solution, from stencil to solder paste."
For more information about FCT Assembly's technologies, quick-turn capabilities and value-added engineering support, visit www.fctassembly.com.
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