The evaluation was comprised of several tests broken into distinct phases. Analytical tests included tackiness, wetting, cold and hot slump, voiding in BGAs, AOI performance, and ease of cleaning. Extended paste print test was evaluated along with defect testing and compatibility with other materials. Based on a weighted scoring matrix, FCT's NL932 was selected as new formulation.
NL932 no-clean, lead-free, halide-free solder paste features excellent solderability, enabling the process to handle the gaii nxkoynegq vdiqdpf rlkkfdgjlsuj. Ntu mdch-cbhd wqjar qdkqyz shrlbpmms urnzu hwpbqfgcjgx lvjn dbau ulauthh odesmskrac zfcbz lmqyrt mbl dpbfx kbgkdry, ku honc ph gdqdiwlmw glczaxu exrcknfllkjgebg ta olj vom wpfghkqb.
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