FCT Assembly Application Engineer Welcomed Into IPC Technical Committees(PresseBox) (Greeley, CO, )
- 5-24A Flux specifications task group
- 5-24B Solder paste task group
- 5-24C Solder alloy task group
The 5-24 Assembly & Joining Materials subcommittee addresses the associated test methods required to evaluate and test materials. Current efforts are directed towards flux, solder paste, solder alloys, adhesives, and surface mount component underfill material.
Lentz has been in the electronics industry since 1994, and worked as a process engineer at a circuit board manufacturer for five years. He has extensive experience performing research and development, quality control, and technical service with products used to manufacture and assemble printed circuit boards. Additionally, Tony has been involved with APEX for many years. He holds B.S. and M.B.S. degrees in chemistry.
For more information, visit www.fctassembly.com.