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Evonik Industries AG Rellinghauser Straße 1-11 45128 Essen, Germany http://www.evonik.com
Contact Ms Dr. Ursula Keil +49 2365 499878
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Evonik Industries AG

Technology in 3D

VESTAMID® HTplus for three-dimensional interconnect devices

(PresseBox) (Essen, )
In VESTAMID® HTplus, Evonik Industries is offering a new-generation PPA that is customized precisely to the requirements of the laser direct structuring (LDS) process. With its outstanding heat resistance, the product is particularly suitable for use in lead-free soldering processes.

VESTAMID® HTplus, which is reinforced with glass fibers and mineral fillers, is available as 50% bio-based PA10T, which has a particularly wide processing window and an extremely low water uptake, and as PA6T/X, which possesses a higher thermal resistance. Both grades exhibit excellent chemical resistance. Their good processability and excellent thermo-mechanical properties make it possible to manufacture high-quality components.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.