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Technology in 3D
VESTAMID® HTplus for three-dimensional interconnect devices
VESTAMID® HTplus, which is reinforced with glass fibers and mineral fillers, is available as 50% bio-based PA10T, which has a particularly wide processing window and an extremely low water uptake, and as PA6T/X, which possesses a higher thermal resistance. Both grades exhibit excellent chemical resistance. Their good processability and excellent thermo-mechanical properties make it possible to manufacture high-quality components.
Laser direct structuring stands for freedom of design, miniaturization, and precision of electronic components. This technology allows to generate metallic conducting structures directly on the surface of three-dimensional plastic substrates. Many applications already make use of this process, for example, cell phone antennae and computers, medical devices, and automotive electronics. Manufacturing by means of injection molding ensures the greatest possible freedom of design.
On the surface of the plastic part, an infrared laser beam produces a preliminary structure -as a microscopic rough surface- that corresponds to the subsequent layout of the conducting paths and also provides chemical-physical activation in this area. This activation is made possible by means of a special additive in the plastic. In the subsequent metallization step, conducting paths are selectively generated that are firmly anchored to the surface.
Visit us at the Hybridica (Hall C1, Booth 630) in Munich between November 9 and 12.
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