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UltraThin Wafer Handling solution introduced by Brewer Science and EV Group (EVG)

UltraThin Wafer Handling solution introduced by Brewer Science and EV Group (EVG)

(PresseBox) (St. Florian/Inn, ) EV Group (EVG), based in St. Florian/Inn, Austria, and Brewer Science, Inc., based in Rolla, Missouri, USA, announce that they have introduced a new system and offer new capabilities and yield performance for UltraThin Wafer Processing.

Semiconductor manufacturers continue to push for increasingly thinner wafers and devices. This push is driven by the need for innovative packaging options such as 3-D packaging and by demands for higher device performance and lower power consumption. Until today, no clearly superior manufacturing process had emerged for handling UltraThin wafers. Brewer Science and EVG have collaborated to create a new temporary wafer bonding technology to provide a novel solution for processing UltraThin wafers. This technology solution is comprised of Brewer Science's WaferBOND™ HT series of materials and EV Group's bonding and debonding equipment platforms (EVG850TBDB) and the development of a solution for safely and reliably processing sub-100 micron thinned wafers.

This jointly developed technology performs temporary bonding of original thickness device wafers onto rigid carrier wafers. The application of the WaferBOND™ HT materials via a spin-coating, baking and subsequent bonding process is performed on EVG850TB system. Highest yield and manufacturing performance through thinning and further backside processing steps are maintained with the created waferstack. In addition, the WaferBOND™ HT material enables utilization of, until today, unknown hightemperature processing steps and high-vacuum compatibility.

The EVG850TB/DB platform is EVG’s well proven and accepted equipment platform, enabling highest yield, performance and uptime in a high-volume manufacturing environment while enabling safe and reliable handling and processing of thin and UtraThin wafers.

The commercialized system is the result of a multiyear partnership between Brewer Science and EV Group. These solutions will be introduced at SEMICON® West 2007, and the companies have extended their collaboration for increasing the process latitude of future material sets.

About Brewer Science

Brewer Science, a multidivisional technology company, has pioneered industry-enabling innovations from ARC® anti-reflective coatings to ProTEK® etch protective coatings. Following on its long tradition of being first to introduce and implement cutting-edge technologies, Brewer Science is proud to introduce WaferBOND™ HT temporary wafer bond series of materials. Brewer Science is a major producer of high-quality materials, processes and machine solutions that meet the stringent requirements of today’s IC, compound semiconductor, MEMS, and optoelectronic industries. Under the leadership of Dr. Terry Brewer, president and founder, Brewer Science continues to develop innovative technologies, reliable products, and responsive services, each attuned to the specific needs of individual customers. Further information on the technology and product information from Brewer Science can be obtained via the company’s website at

EV Group Europe & Asia/Pacific GmbH

Founded in 1980, EV Group (EVG) is a global supplier of wafer bonders, aligners, thin wafer-, temporary bonding and debonding-equipment, photoresist coaters, cleaners and inspection systems for semiconductor, MEMS and emerging nanotechnology markets. EV Group holds the dominant share of the market for wafer bonding and debonding equipment and is a leader in lithography for advanced packaging, MEMS and Nanoimprint Lithography (NIL).

The company's unique Triple i-approach (Invent - Innovate - Implement) is supported by a vertical infrastructure, allowing EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. Headquartered in St. Florian, Austria, EV Group operates via a global customer support network, with subsidiaries in Tempe, Arizona; Albany, New York; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. For more information, visit and our EVG-TShop “Click, Stop – the new way to shop”