DI Erich Thallner Straße 1
4782 St. Florian am Inn, at
+43 (7712) 5311-0
EV Group's GEMINI Wafer Bonder Selected by Leading Korean Research Center and Foundry Service Provider RFID/USN for 3D MEMS Manufacturing
Company Witnesses Positive Momentum in the Korean MEMS Market
"As a foundry service provider, we strive to offer our customers with cutting-edge technologies to support their 3D MEMS production needs, and as such, require a flexible system that can adapt to a wide range of requirements," said RFID/USN Center's executive director, Dong-suk Han. "Given the stringent demands of the leading-edge MEMS market, particularly for 3D devices, we evaluated a number of bonding solutions on the market for MEMS production, and in the end, chose EVG's GEMINI not only for its superior reliability and high-volume capabilities, but also for its flexibility and extendibility. The GEMINI enables us to quickly adjust the chuck to handle both 6- and 8-inch wafers, offering the highest available uptime in the market to ensure around-the-clock operation--a significant factor in our decision."
Commenting on today's announcement, Paul Lindner, EVG's executive technology director noted, "This opportunity to cooperate with a leading Korean MEMS foundry, such as the RFID/USN Center, is an important step for EVG as we continue to expand our footprint in the growing Korean market. Following the opening of our Korean subsidiary in the summer of 2008, we have witnessed positive momentum in the market, and are fully committed to serving the needs of the region in the future. Lindner added, "We have long served the MEMS market, and this order win is further testament to the strength of our solutions to address the production demands of advanced technologies, such as 3D MEMS devices."
EVG's GEMINI platform is a field-proven, production manufacturing solution for high-volume wafer bonding applications for MEMS, 3D IC integration and advanced packaging, as well as compound semiconductor applications. Its modular design offers customers a highly flexible and extendible platform that enables customers the opportunity to incorporate pre-processing options such as cleaning and plasma activation modules, as well as additional bond chambers to augment throughput. Additionally, this fully automated wafer bonding system integrates EVG's SmartView® aligner, which yields precision alignment accuracy, as well as wafer handling expertise into one wafer bonding platform. The GEMINI maintains an installed base of more than 100, contributing to EVG's 75-percent market share dominance in wafer bonding.
Die Nutzung von hier veröffentlichten Informationen zur Eigeninformation und redaktionellen Weiterverarbeitung ist in der Regel kostenfrei. Bitte klären Sie vor einer Weiterverwendung urheberrechtliche Fragen mit dem angegebenen Herausgeber. Bei Veröffentlichung senden Sie bitte ein Belegexemplar an email@example.com.