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EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Straße 1 4782 St. Florian am Inn, Austria http://www.evgroup.com
Contact Ms Karen Do +1 650-968-8900
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EV Group Europe & Asia/Pacific GmbH

EV Group Installs Fusion Wafer Bonding Systems at Two Leading CMOS Image Sensor Manufacturing Facilities in Asia

Company Reinforces Leadership in Wafer-Level 3D Integration

(PresseBox) (Dresden, Germany, )
SEMICON Europa 2009 -- EV Group (EVG), a leading supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, today announced that it has completed the installation of two automated fusion bonding systems for 300-mm wafers at a leading semiconductor foundry and at a major consumer electronics manufacturer. The GEMINI® FB automated production fusion bonding systems will be employed for the production of backside illuminated CMOS image sensors ranging from ultra-compact wafer-level cameras for mobile phones to larger form factor high-end image sensors. These fusion bonding systems were selected based on their ability to meet key lafbdewb dldwgopgjnpg ikl rsi vjyg ak hrquypexy (KzO), vgai cymuxxrumb ahx elii bczfxtzix obyeoant.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.