EV Group Files Patent Infringement Lawsuit Against the 3M Company
DI Erich Thallner, president of EVG, notes, "EVG's success depends on the protection of our intellectual property. When a company infringes on our rights, we have a responsibility to protect the tremendous investments we've made in research and development on behalf of our customers, suppliers and employees. To this end, we will vigorously protect our arsenal of technology innovation from those who we feel are competing unfairly through legal recourse, if necessary, as is the case here."
Semiconductor wafer manufacturing typically involves hundreds of discrete operations on the surface of a silicon wafer, which are performed over a number of weeks. In order to minimize wafer breakage and damage, which can easily occur during this lengthy manufacturing process, the base wafers are typically 700- to 800-microns thick. Stacked die packages require significantly reduced final wafer thickness in order not to create unacceptably tall packages. The more dies that can be packaged in a stack, the better. The device claimed in the patent enables silicon wafers to be thinned to less than 50 microns with standard back grinding equipment, which means that a greater number of dies can be stacked-providing greater performance without an increase in height.
EV Group Europe & Asia/Pacific GmbH
EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.
In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for chip packaging and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.
Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. The company's vertical infrastructure allows EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at http://www.evgroup.com.
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