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Press release Box-ID: 190569

EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Straße 1 4782 St. Florian am Inn, Austria http://www.evgroup.com
Contact Thomas Fodermeyer +43 7712 53110
Company logo of EV Group Europe & Asia/Pacific GmbH
EV Group Europe & Asia/Pacific GmbH

EV Group Files Patent Infringement Lawsuit Against the 3M Company

(PresseBox) (ST. FLORIAN, Austria, )
EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, today announced that it has filed a patent infringement lawsuit in federal court of New York against the 3M Company ("3M"). The complaint alleges that 3M has infringed upon a U.S. Patent through the marketing and sale of the 3M Wafer Support System, which is used in the production of silicon wafers. The complaint seeks damages to compensate EVG for 3M's wrongful infringement and an injunction against 3M from all future infringement of the Patent.

DI Erich Thallner, president of EVG, notes, "EVG's success depends on the protection of our intellectual property. When a company infringes on our rights, we have a responsibility to protect the tremendous investments we've made in research and development on behalf of our customers, suppliers and employees. To this end, we will vigorously protect our arsenal of technology innovation from those who we feel are competing unfairly through legal recourse, if necessary, as is the case here."

Semiconductor wafer manufacturing typically involves hundreds of discrete operations on the surface of a silicon wafer, which are performed over a number of weeks. In order to minimize wafer breakage and damage, which can easily occur during this lengthy manufacturing process, the base wafers are typically 700- to 800-microns thick. Stacked die packages require significantly reduced final wafer thickness in order not to create unacceptably tall packages. The more dies that can be packaged in a stack, the better. The device claimed in the patent enables silicon wafers to be thinned to less than 50 microns with standard back grinding equipment, which means that a greater number of dies can be stacked-providing greater performance without an increase in height.

EV Group Europe & Asia/Pacific GmbH

EV Group (EVG) is a world leader in wafer-processing solutions for semiconductor, MEMS and nanotechnology applications. Through close collaboration with its global customers, the company implements its flexible manufacturing model to develop reliable, high-quality, low-cost-of-ownership systems that are easily integrated into customers' fab lines. Key products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems.

In addition to its dominant share of the market for wafer bonders, EVG holds a leading position in NIL and lithography for advanced packaging and MEMS. Along these lines, the company co-founded the EMC-3D consortium in 2006 to create and help drive implementation of a cost-effective through-silicon via (TSV) process for chip packaging and MEMS/sensors. Other target semiconductor-related markets include silicon-on-insulator (SOI), compound semiconductor and silicon-based power-device solutions.

Founded in 1980, EVG is headquartered in St. Florian, Austria, and operates via a global customer support network, with subsidiaries in Tempe, Ariz.; Albany, N.Y.; Yokohama and Fukuoka, Japan; and Chung-Li, Taiwan. The company's vertical infrastructure allows EVG to respond quickly to new technology developments, apply the technology to manufacturing challenges and expedite device manufacturing in high volume. More information is available at http://www.evgroup.com.

EVG is a registered trademark of EV Group. All other trademarks or registered trademarks mentioned in this release are the property of their respective holders.

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The publisher indicated in each case is solely responsible for the press releases above, the event or job offer displayed, and the image and sound material used (see company info when clicking on image/message title or company info right column). As a rule, the publisher is also the author of the press releases and the attached image, sound and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.