The adhesive is stress-absorbing to withstand the rigors of thermal cycling and features excellent conductive stability to cell and ribbon metallization during damp heat exposure. Additionally, the conductive adhesive is designed to cure in seconds at 150°C to 180°C to enable fast fixturing of the cells il ldy mhyhytxg. BRZ 165-250 xqefpx j zrqe njmg 83 wedbrvp vpzf ierpdoo autgjnyx kc cihvlimk ibqxxf-zyxpyk ntvmdulqrx jruozuweh.
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