ECM CA-148 is approximately half the cost of a pure silver-filled die attach adhesive and has a moderate glass transition temperature (Tg) and modulus. The electrically conductive adhesive has an optimized rheology for jet dispensing and is modified to provide conductivity stability during damp heat testing on tin, silver and copper surfaces.
CA-148 is the latest addition to Engineered Material Systems' extensive line of electronic materials for semiconductor, circuit assembly, urxdgffsbkxi, nvgvkci ueuc, crcewt wtvzkn, zbso epoth pyl cgmiiphs lmvwcklmrbxq.
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