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Engineered Materials Systems 132 Johnson Drive 43015 Delaware, Ohio, United States http://www.emsadhesives.com
Contact Mr Mark Francis +1 740-203-2950
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Engineered Materials Systems

Engineered Material Systems Debuts Low-Temperature Cure/Snap Cure Conductive Adhesive for Die-Attach Applications

(PresseBox) (Delaware, Ohio, )
Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, introduces the CA-180 Low Temperature Cure/Snap Cure Conductive Adhesive designed for die-attach applications in smart cards, circuit assembly, photonics or camera modules.

ECM CA-180 will cure in 30 minutes at 80°C or in seconds at 200°C, and has a moderate glass transition temperature (Tg) and modulus. CA-180 has an optimized rheology for needle dispensing by time-pressure, auger or positive displacement. Unlike most conductive adhesives, CA-180 develops excellent conductivity with short, low-temperature cures. After curing for 30 minutes at 80°C, its electrical conductivity is 0.00006 ohm-cm.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.