Full Speed Debugging of 0.5mm pitch BGA133 possible with PB-BGA133A-Z-01 Socket Probe Adapter with chip size SMT base

Idstein, (PresseBox) - Ironw ood Electronics' PB-BGA133A-Z-01 Socket Probe Adapter allows high-speed testing of BGA device while accessing the signals using testers via header pins. Features of the PB-BGA133A-Z-01 include shortest possible trace length for maximum speed, low inductance, low capacitance, blind and buried via PCB design technology, designed to interface with 0.5mm pitch Fine pitch Ball Grid Array (FBGA) packages.

Ironwood's PB-BGA133A-Z-01 Socket Probe Adapter consists of two parts. The surface mount base is soldered to the target system board in place of BGA133, 0.5mm pitch, 14x14 array, 11mmX10mm body. The probe board with elastomer socket plugs into the SMT base and employs a PCB to deliver all data, address, control, and clock signals to header pins on 2.54mm centers. The socketed 133 pin BGA chip top module will plug into the female BGA socket soldered to the development board.

The temperature range is -35C to +100 C. The pin self inductance is 0.15 nH and mutual inductance of 0.025 nH. Capacitance to ground is 0.01 pF. Current capacity is 2 amps per pin.

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