EIPC have busy event schedule at SMT HYBRID PACKAGING in Nuremberg

(PresseBox) ( Maastricht, The Netherlands, )
The European Printed Circuit Association have planned a very intensive schedule for their activities which are being held alongside the SMT HYBRID PACKAGING SHOW in Nuremberg on May 3rd - 5th 2011.

On May 3rd there will be a one-day seminar on 'Imaging & Registration' during which a range of speakers from around the world will bring the audience up-to-date with new technologies all designed to improve productivity and meet the increasingly stringent demand for tighter tolerances. Speakers will cover digital imaging, inkjet technology, laser printing, and the effect of design and registration tolerances on reliability.

On May 4th there will be a JISSO European Council Seminar. Here a selection of topics will be discussed, all of which are aimed at improving the competitiveness of the European electronics industry in general. A Global Roadmap will be presented, and a long look at the activities both past and present for the creation of national and international standards for embedded components.

On May 5th it is 'SurfEnergy' that will occupy the delegates' attention at a one-day workshop. Here ways to improve energy efficiency in the PCB and surface finishing industries will be described, obtained through process analysis and the resulting plans needed to not only save money but improve efficiency will be detailed.

All these events will be held in the Conference Centre East (Ost) Exhibition in Nuremberg
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