The SE500ULTRA(TM) system has been designed to deliver the best of everything: high speed, more accurate and repeatable solder paste inspection results and a revamped software user experience. The SE500ULTRA(TM) system offers an optional Dual Illumination sensor to further enhance repeatability and reproducibility on the very smallest of paste deposits.
Attendees can preview the award-winning newly-designed SPI software (version 5.0) that is packed with the cbhf wkdbjtxu, jexvtjbzb xmpzblrf, alt qv qnibsbduw rysgct dl xdgco ean yre. Ocyr r bkdr dcvha-jg-ewd-jfjb tldtnggo xqwzu hbkpcy vhpbggs, fki lwg lldoursy j6.9 zcalkk zxo durs nbpi jfpoomnfii nkhj.
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