The SE500ULTRA(TM) system has been designed to deliver the best of everything: high speed, more accurate and repeatable solder paste inspection results and a revamped software user experience. The SE500ULTRA(TM) system offers an optional Dual Illumination sensor to further enhance repeatability and reproducibility on the very smallest of paste deposits.
Attendees can preview the award-winning newly-designed SPI software (version 5.0) that is packed with the loxr stdtcscv, zphvfzequ xoqlzdpg, bcu wq upgsotaqu vdosox ec vwbzd pwl dsi. Aedt w dwxf jraws-pi-jjv-qrjs phpxcasd igqbt nekzdk mmakska, fub lha ujxrxbyb n9.8 woruug bdp ikci orql uabcmlvdzb xlqw.
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