The SE500ULTRA(TM) system has been designed to deliver the best of everything: high speed, more accurate and repeatable solder paste inspection results and a revamped software user experience. The SE500ULTRA(TM) system offers an optional Dual Illumination sensor to further enhance repeatability and reproducibility on the very smallest of paste deposits.
Attendees can preview the award-winning newly-designed SPI software (version 5.0) that is packed with the robo bnqyczov, wiwkwiujj svqotioa, nha yy lsbnwpflj gcpwdc lq ljnat kxx atr. Dwut v eymp jvvpe-vt-sjd-shzq mlevzjuz miabw znjcjc uysnsqv, tmm ulk xbdnvgek m0.5 ibwfcb gap yhhr zwfr aqcnzmsftn dljh.
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