5900 Golden Hills Drive
55416 Minneapolis, MN, us
CyberOptics to Highlight 'True' Height Measurement and Fastest Programming at INTERNEPCON Japan
The supreme SE600™3D SPI system delivers 'true' height measurement and sets a new bar for height accuracy measurements. This combined with world-class usability makes it the ideal inspection solution for automotive, medical, military and other top niche markets. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility - even on the smallest paste deposits. The award-winning SPIv5 series software offers full touch screen capability and world-class user experience for easy, flawless inspection. The intuitive software includes multi-touch, multi-selection, unlimited undo-redo options and much more to enable hassle-free operation and shortest learning curve.
The QX600™ ultra-fast, ultra-versatile AOI system offers the fastest programming time with production-ready capability in less than 13 minutes. Built with an all-new Strobed Inspection Module (SIM), the QX600 delivers the best 01005 and solder joint inspection ever. A higher sensor resolution (12 µm) captures brilliant and crisp quality images for accurate defect review. With AI2 (Autonomous Image Interpretation) and standard SAM (Statistical Appearance Modelling) technologies, you can inspect anything and you don't have to anticipate defects or predefine variance. With its unique ability to 'ignore' bad examples in a model, AI2 offers precise discrimination even with excessive variance and delivers accurate results with just one example.
Also from the AOI family, the QX100i™ system will be on display offering high value and flexible inspection for all applications, making it the ideal choice for selective solder and pre-reflow applications.
For more information, please visit www.cyberoptics.com.
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