5900 Golden Hills Drive
55416 Minneapolis, MN, us
CyberOptics to Demonstrate Superior Technology, High Quality and Lowest Cost of Ownership at NEPCON China
The SE600™ 3D SPI system delivers 'true' volume measurement and world-class usability. Designed with a state-of-the-art dual illumination sensor, it offers the best repeatability and reproducibility - even on the smallest paste deposits. The award-winning SPIv5 series software offers full touch screen capability and world-class user experience for easy, flawless inspection.
The QX600-L™ is powered by a 150 Megapixel sensor enabling improved solder joint and 01005 inspection performance. It can cater to board sizes all the way up to 510(L) x 590(W) mm making it an ideal choice for EMS - covering all applications ranging from small consumer electronics to large telecom server products.
The QX100i™ AOI offering high value, flexible AOI inspection provides an ideal solution for pre-reflow inspection and selective solder applications.
All CyberOptics' AOI systems are powered by AI2 (Autonomous Image Interpretation), giving you the power to inspect 'ANYTHING' without having to anticipate defects or predefine variance. AI2 offers precise discrimination even with excessive variance and delivers accurate results with just one example. All this means lowest false calls, zero escapes and minimal tuning.
Apart from the above, CyberOptics will also demonstrate value-add solutions: CyberPrint OPTIMIZER™, closed loop printer feedback, mounter feed forward, and more - all with a unified purpose - better process, better yield.
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