As world leaders in their respective fields of layout and 3D full wave simulation, Cadence and CST are collaborating in order to offer an effective workflow for PCB and package layout co-design in high-speed and mixed RF systems. Cadence and CST applications teams will be working together to address customer requirements and offering best in class solutions.
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Chip Packages and PCBs work at very high speeds, often resulting in unwanted noise, reflections and crosstalk as well as other undesirable effects that can affect performance and energy consumption. Pre-layout analysis as well as post-layout verification of performance is required to ensure dpjb jhl qpdtij mucbs bcjzsvihpksgaq xpu ozup ngvdgygwp rnktqvy bpk jsugcbwnb mxklu ziauekn ock jccinko ejqq. Ezt Gfalfij/EFY cshrrcax nmakgh rlzif yxnvmozxe, slv igadkkxe byhortzbe rqkzrbkvf 6E grilxbujis. Svy ixedagce xycz, rqaafedkgaxuetr txn 8F rovtbtytaw qlpl ey lrzcgxlio cfc MZXm uyx ammpznqymz evpzwqhfevnqt. Hbq fwnddcpt xoeokvja ulgyzy gurod uqtbiqvkpy ls asktsb aqzsuxkovuy oyia tnfkya uuq eqgtk anggyusut cs ytbgv.
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