The AVIA LX 355-20 is an economical new q-switched, diode-pumped solid-state (DPSS) laser offering substantially longer operating lifetime than competitive products at similar power levels. The AVIA LX 355-20 delivers 20 W (at 50 kHz repetition rate) at 355 nm, a diffraction limited (M² <1.3) beam, and an expected lifetime of 20,000 hours.
An unmatched combination of performance, reliability and economy make this laser an ideal choice for cutting, drilling and marking in microelectronics fabrication and packaging. Applications include cutting flex material, chip and mold form marking, IC package trimming, as well as wafer scribing and cutting. In addition, 3D
An unmatched combination of performance, reliability and economy make this laser an ideal choice for cutting, drilling and marking in microelectronics fabrication and packaging. Applications include cutting flex material, chip and mold form marking, IC package trimming, as well as wafer scribing and cutting. In addition, 3D
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