CETECOM Earns Further Accreditation for MasterCard Contact & Contactless Testing
Summary: CETECOM's SmartCard Competence Center extends its global service offering through further MasterCard accreditation for the CETECOM laboratory in Anyang, Korea
End of 2014, CETECOM earned further accreditation for MasterCard contact and contact less testing in the laboratory in Anyang, Korea:
PayPass M/Chip Flex.
M/Chip4 Advance Payment
M/Chip4 Advance Payment including Data Storage
Mobile PayPass M/Chip
Additional Timing Measurement
“With this accreditation for our laboratory in Korea, CETECOM’s global SmartCard Competence Center earns a revaluation”, says CETECOM CEO Wilfried Klassmann. “With already established accreditations for MasterCard Terminal PayPass v3.x and MasterCard Mobile Payment, the accreditation advances our service offerings in Asia and adds more value to our clients.”
For more information about CETECOM´s SmartCard Competence Center and its global service offerings in Europe, North America and Asia, please visit http://www.cetecom.com/de/testing/smartcard-technologie.html.
For over twenty years, the CETECOM Group has been renowned as an independent test laboratory for mobile phones and other wireless devices. With over 400 employees and test labs in Europe, North America and Asia, CETECOM offers a unique service portfolio servicing the entire range of cellular and consumer wireless products. CETECOM is a leading test and certification lab for smart cards, RFID and NFC applications. CETECOM's global service portfolio includes certification testing for Visa Mobile Payment Contactless Level 1 and Visa Mobile Payment Application (VMPA).
CETECOM provides testing services, consulting and training for wireless technologies: GSM, WCDMA, LTE, CDMA, Bluetooth, Wi-Fi, NFC and other systems. The company also performs a wide range of testing in the areas of mobile software applications, OTA, SAR, FCC, EMC, field trials, acoustics, batteries and accessories. CETECOM participates in the development of global standards and test specifications.