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Cascade Microtech Wins Global Technology Award for High Performance, Low Cost Test Socket
Gryphics' BGA test socket deemed "the best in the world" by Global SMT & Packaging(PresseBox) ( Beaverton, Oregon, )
Introduced in January of this year, the Grypper socket is ideal for mobile applications. This high performance, low cost, fine pitch socket tests 0.4mm and 0.5mm pitch devices where the PCB (printed circuit board) holes for external fasteners and additional hardware cannot be accommodated.
The award winners were selected by a panel of international judges, who chose products worthy of being recognized as "the best in the world." Entries were evaluated based on innovation, speed, quality, cost effectiveness, environmentalism, and ease of use and maintenance.
"We are thrilled to be recognized on an international level by Global SMT," said Mike Kondrat, vice president of marketing, Production Products Division, Cascade Microtech. "With the addition of the Gryphics Product Group earlier this year, we have been pleased to add world-class test sockets to our growing portfolio of production test consumables. This confirmation from industry judges validates our direction of delivering innovative high performance test solutions while driving down the overall cost of ownership for our customers."
About the Grypper BGA Test Socket
Gryphics Product Group, a part of the Production Products Division of Cascade Microtech, introduced their new Grypper™ BGA test socket in January 2007. The socket utilizes Gryphics' advanced manufacturing and contact technologies to achieve a very fine pitch with low inductance and low insertion loss beyond 15 GHz. The unique contact design provides excellent mechanical and electrical performance, with oxide-penetrating actions to achieve stable contact resistance for varying solder compositions. This provides excellent signal fidelity for today's high frequency applications, such as advanced high speed serial buses and wireless RF interfaces. The Grypper socket is uniquely suited for chips designed for mobile and consumer applications, where fine-pitch BGA devices can be socketed right on the actual production or evaluation RF circuit board without any additional PCB area overhead.
About Global SMT & Packaging
Global SMT & Packaging is the monthly magazine from Trafalgar Publications covering SMT news worldwide. Based in Glastonbury, England, it is run by a comprehensive packaging and electronics team, targeting production engineers, researchers, purchasing managers and senior staff at electronics manufacturing facilities. Global SMT & Packaging can be found on the Web at http://www.globalsmt.net.
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