Brewer Science Presents New Materials, Processes, and Equipment Innovation at SEMICON China and CSTIC

(PresseBox) ( Rolla, MO, )
Brewer Science, the inventor of ARC® anti-reflective coatings that have enabled the progress of advanced lithography, continues to deliver diverse technology solutions for FEOL and BEOL device fabrication which will be presented at the China Semiconductor Technology International Conference (CSTIC) and at SEMICON China, 19-21 March 2013, in Shanghai, China.

Brewer Science will share advancements in lithography solutions for semiconductor device manufacturing, ZoneBOND® technology, and other thin wafer handling technologies critical for 3-D IC implementation, including Brewer Science® Cee® low-volume wafer processing equipment.

Dr. Zhimin Zhu, Senior Scientist at Brewer Science, will present "Robust Trilayer Patterning Technique" at CSTIC on Monday, 18 March. Dr. Zhu will share results of Brewer Science's recent research and development work to achieve a wide critical dimension processing window (CD PW) for lithography using a spin-on trilayer patterning stack. The technique can be used to produce lines and contact patterns in a single lithographic process.

"One of the near-term challenges facing the semiconductor industry is cost-effective manufacturing and the capability to increase the photolithography critical dimension processing window," said Dr. Zhu. "Our research at Brewer Science addresses this challenge, as a larger CD PW reduces rework and increases yield."

To learn more about this method, please attend Dr. Zhimin Zhu's oral presentation Monday, 18 March, at 16:40 China Standard Time, or email

Visit Booth 3248 at SEMICON China, to learn more about Brewer Science's advanced technologies that can help solve your processing needs.
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