Supporting virtual reality application for project planning
360-degree immersive experience of planned packaging plant
VR and AR applications with a future
At this year's PACK EXPO International in Chicago, USA from October 14 to 17, Bosch Packaging Technology will present its new virtual reality planning tool "Virtual Layout" at booth S-3514. The Bosch software converts a two-dimensional sketch into a three-dimensional image of the planned packaging system within a very short space of time. The system is displayed on the customer's hall plan on a 1:1 scale. In addition, the VR glasses and associated controllers facilitate a virtual walk-through.
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