Press release BoxID: 140858 (BOPLA Gehäuse Systeme GmbH)
  • BOPLA Gehäuse Systeme GmbH
  • Borsigstraße 17-25
  • 32257 Bünde
  • Contact person
  • Katharina Mense
  • +49 (0)5223-969105


(PresseBox) (Bünde, ) BOPLA Gehäuse Systeme GmbH's BOS-Ecoline enclosure series combines the advantages of aluminium profiles with the optimal cost-effectiveness of plastic caps to create a superior enclosure system. A range of different sizes and profile types permits use with an extremely large number of applications in the electronics sector. BOS-Ecoline is especially suitable for use as an interface enclosure and for applications in mobile data acquisition.

Four cross-section formats are available, each in a closed, open-on-one-side or divided version. The ingress protection category can be increased from IP40 to IP54 by means of a set of seals. The profiles of the enclosure series are equipped with grooves to hold PCBs and mounting plates.

In addition to the mechanical processing of the BOS-Ecoline enclosures, BOPLA also offers customer-specific membrane keypads and the assembly of complete enclosures.