Bünde, (PresseBox) - BOPLA Gehäuse Systeme GmbH's BOS-Ecoline enclosure series combines the advantages of aluminium profiles with the optimal cost-effectiveness of plastic caps to create a superior enclosure system. A range of different sizes and profile types permits use with an extremely large number of applications in the electronics sector. BOS-Ecoline is especially suitable for use as an interface enclosure and for applications in mobile data acquisition.

Four cross-section formats are available, each in a closed, open-on-one-side or divided version. The ingress protection category can be increased from IP40 to IP54 by means of a set of seals. The profiles of the enclosure series are equipped with grooves to hold PCBs and mounting plates.

In addition to the mechanical processing of the BOS-Ecoline enclosures, BOPLA also offers customer-specific membrane keypads and the assembly of complete enclosures.

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