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ATP Releases the DDR3 SO-RDIMM & Mini-RDIMM Series for Space-Constrained Applications
Networking & communication applications, such as CompactPCI, AdvancedTCA, and embedded computing systems require specific characteristics not fully met with the current array of DRAM products. The ATP SO-RDIMM and mini-RDIMM are not only flexible in shape and size, but also offer the highest level of performance. The entire series is built with the highest quality chips and materials and strictly tested for extreme conditions. The ATP SO-RDIMM and mini-RDIMM series is fully compliant with JEDEC standards and supports built-in ECC and address parity.
"ATP Electronics is committed to providing unsurpassed technology that is customizable and can accommodate the different needs of the industrial market. Our newly released DDR3 SO-RDIMM & Mini-RDIMM modules provide flexibility for the increasing need of space efficiency without compromising the high level of execution and reliability that is associated with the ATP brand," said Michael Plaksin, ATP Vice President of Sales and Marketing.
Other ATP products of the small outline memory module family include the 1GB/2GB DDR3 unbuffered ECC Mini-DIMM, the 2GB/4GB DDR3 unbuffered ECC SO-DIMM, and the 4GB DDR2 SO-RDIMM. All products undergo strict in-house testing to ensure product quality and reliability. ATP SO-RDIMM and Mini-RDIMM products are synonymous with high performance, high reliability and high stability. In addition, an optional wide temperature and conformal coating is available as an added feature to all ATP module product lines.
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