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Asymtek Sells Spectrum(TM) S-910N Dispensing System to DancoTech
DancoTech's 11th Asymtek Dispensing System
Dancotech purchased Asymtek's S-910N dispensing system, configured for surface mount adhesive (SMA) jetting, for applications and product development in their Center of Excellence. Their first Asymtek system was purchased in 1999. Over the years they have added ten more dispensers to support a wide range of applications, including underfill and SMA jetting, dam and fill, conformal coating and solder paste dispensing, using a variety of Asymtek's valve technologies from pumps to jets to piezo-electric technologies.
"We have chosen Asymtek for our dispensing requirements because of their deep knowledge and expertise in automated fluid dispensing," said Pernille Louise Vinten, Production Technology Manager for DancoTech. "Our customers want quick-turn solutions with state-of-the-art technology. Asymtek's dispensers provide a high level of process control, flexibility, and capability that supports this requirement. Our new Spectrum S-910N systems give us more capability in a smaller footprint, saving valuable space on our production floor."
"Shipping the 11th dispensing system to DancoTech is a key milestone for Asymtek," states Asymtek's Global Account Manager, Lars Nielsen. "DancoTech is a great company to work with, and we are committed to consistently providing innovative, quality solutions that exceed their needs and expectations."
Asymtek's Spectrum S-900N Series dispensing system is designed with maximum flexibility, configurable for a wide variety of applications. It can handle high-volume applications, such as edge- and corner-bonding that do not require heat, and can be configured with up to three heat stations for applications that require heat, such as flip chip and CSP underfill. With its scalable configuration, the Spectrum S-900N platform can be configured with single or dual lanes depending on capacity requirements. As process needs change, the system can be upgraded to add options not previously required.
DancoTech, a member of the Danish-owned William Demant Holding (WDH) Group, is a Center of Excellence focused on the development and production of microelectronic components with expertise in chip stacking, fine-pitch wire bonding, flip-chip and fine-line surface mount adhesive device applications. DancoTech works closely with clients, efficiently designing concrete solutions that meet and exceed their requirements for fine-line multilayer print, flex-rigid print, fine-line flexprint, and thick film substrates. DancoTech is a DS ISO 9001:2000 company. For more information, visit www.dancotech.com.
Nordson Corporation is one of the world's leading producers of precision dispensing equipment that applies adhesives, sealants, and coatings to a broad range of consumer and industrial products during manufacturing operations. The company also manufactures equipment used in the testing and inspection of electronic components as well as technology-based systems for curing and surface treatment processes. Headquartered in Westlake, Ohio, Nordson has more than 4,100 employees worldwide, and direct operations and sales support offices in 32 countries. For more information, visit www.nordson.com.
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