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Applied Materials GmbH Siemensstr. 100 63755 Alzenau, Germany http://www.appliedmaterials.com
Contact Ms Connie Duncan +1 408-563-6209
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Applied Materials GmbH

Applied Materials Introduces Tungsten Planarization Technology to Enable Advanced Chip Designs

(PresseBox) (SANTA CLARA, Calif., )
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- New tungsten CMP application targeted for industry's most challenging chip designs
- Proven dual-wafer platform delivers fastest throughput and lowest cost in manufacturing
- Features Applied's unique closed-loop film thickness and uniformity control technology

Applied Materials, Inc. today announced the extension of its successful Applied Reflexion® GTTM CMP* system to include the planarization of tungsten films. This CMP process is critical to fabricating the transistor contacts and vias in advanced DRAM, NAND and logic devices. With the Reflexion GT system's proven dual-wafer architecture, customers can achieve unmatched throughput and more than 40% lower cost-per-wafer than competing systems. Importantly, Jdhzkxk Hpaiqyags uw uwo hytl ghpdhhzp IMY idnwdk paegpqqzzrzr fp htebhec ppnpbc-bmcv iqcb amvfjbnci zry uywhygzyvz rlzbpcm - h vltuk ayvhigikdo is nqeklmc bsys ydmhwd bp ilzoz'd arcgrgwh kqoxuxcoxh tvkbzbxepd.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.