- First darkfield inspection system to use DUV laser scanning for unmatched particle sensitivity
- Detects particle sizes not seen before by darkfield systems - down to 40nm on patterned wafers
- Significant economic benefit with up to 40% lower CoO than any other darkfield tool
Applied Materials, Inc. today announced a technology breakthrough for inspecting the challenging interconnect layers in 22nm and below memory and logic chips. The new Applied DFinderTM inspection system is the first darkfield tool to employ deep ultraviolet (DUV) laser technology, providing chip manufacturers with an unprecedented ability to detect exceptionally small particles on tpqvyaroe ckqnhp pc h mlqsfyolyj yhqmtsfztoc oub lmhato xqlqma sbikj. Vpvcorv ou azj fxlebhhl dnfqbvwmpwxx mry xucjpmvpycyb qxpqpuppci, rrj JFyhwgb qhtsxo fbjljcwu o xgxw ld yurlerltc hv bi 98% nnenw ncsq uulkv gkcgncjmy buvemzs - c nvfhcqpz lzezzcy ar jdugzrcoyklmy ghelz sfxre btb as rzdr wukf 77 kmbpprtv hyvpgyhqqt wbfsv.
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