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European Leaders In Packaging To Speak At Thin Wall Packaging Conference 2013
AMI's 8th Thin Wall Packaging conference will take place in Cologne from 3-5 December 2013
Thin wall packaging can be used in a wide range of applications. The ambient long-life food sector positioning is challenged with consumer concerns about quality in comparison with the chilled and/or frozen variants. Canned meals are perceived as inferior quality, less fresh and less authentic products. The segment is in need of modernisation, which can be done with the use of new plastic packaging solutions, and their improved process technology to deliver higher quality, long-life food products. Plastic packaging has the potential to re-vitalise mature markets such as soup, canned fruit, vegetables and fish, by introducing convenient, added value containers suited to modern day living. Silgan Plastic Food Containers will explain the trends in ready meals packaging.
Long-life barrier properties are created using a variety of technologies, which will be discussed at the Cologne conference. AMI will present findings on retortable packaging formats. Aspects of barrier co-extrusion thermoforming will be presented by Kuraray Eval, supplier of EVOH while Mold-Masters will explain the merits of using barrier co-injection. University Hasselt will present the research findings on the oxygen permeability versus thickness of thermoformed trays.
The development of technologies used in TWP is driven by increased efficiency and cost savings. The audience will appreciate the brand-owner's perspective on operational efficiency for yoghurt packaging presented by General Mills. The suppliers of injection moulding machinery, Arburg and Engel, and extrusion machinery, SML, will explain how further efficiencies can be achieved in thin wall moulding. Cost savings can also be achieved by working with innovative material technologies, such as foaming (presented by Coopbox) and natural filler compounds (presented by Mondo Minerals).
Working with product image is critical for improved shelf-impact. Paper Pak Industries will show how absorbents can help creating smarter food packaging. Illig will talk about advancements of IML technology in thermoforming. Trexel will discuss how the effects of 3D technology can be used to enhance product packaging. Sumitomo Demag will present innovative colour technology for thin wall packaging. Ineos Olefins & Polymers will explain the material development around organoleptics.
AMI's Thin Wall Packaging 2013 is relevant for all members of the supply chain including brand owners, retailers, packaging companies, food experts, researchers, test houses, materials and manufacturing experts.
Thin Wall Packaging 2013 is sponsored by Illig, Borealis, Kuraray and Kortec.
The full programme can now be found on AMI's website: www.amiconferences.com. For further information on attending, exhibiting or sponsoring this event please contact Maud Lassara, Senior Conference Organiser at AMI Conferences: on firstname.lastname@example.org or +44 (0) 117 924 9442.
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