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Amicra Microtechnologies GmbH Marie-Curie-Str. 6 93059 Regensburg, Germany http://www.amicra.com
Contact Mr Dr. Johann Weinhändler +49 941 20820980
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Amicra Microtechnologies GmbH

Amicra to Demonstrate Advanced Die and Flip Chip Bonders at Semicon Taiwan 2013

(PresseBox) (Regensburg, Germany, )
Amicra Microtechnologies GmbH, a worldwide leading provider of high-precision micro-assembly equipment and customized electronics manufacturing solutions, comes to this year's Semicon West to demonstrate its latest advanced die and flip-chip bonders AFC Plus and NOVA Plus. Amicra will exhibit at TWTC Nangang Exhibition Hall in Booth 1024.

Amicra's high-accuracy NOVA Plus and AFC system are perfectly suited for die and flip-chip processing including 3D and stack-die, covering the full scope of high-volume micro/nano assembly applications. They are laid out for bonding processes, offering optional flip-chip bonding, wafer mapping, and post-bond inspection.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.