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AMD GmbH Einsteinring 24 85609 Dornach b. München, Germany http://www.amd.com/
Contact Mr Michael Schmid +49 89 45053151
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AMD GmbH

AMD Offers New Package Features for Embedded Markets

Helps system designers reduce enclosure size without sacrificing performance

(PresseBox) (Sunnyvale, Calif., )
AMD (NYSE: AMD) today announced immediate availability of the AMD Sempron(TM) 210U and 200U processors for embedded systems. These new processors are available with five year longevity that is standard for AMD embedded components and feature lidless Ball Grid Array (BGA) packaging with the low power and high performance of AMD's Direct Connect Architecture.

"These new lidless BGA packaged processors can help customers significantly shrink their embedded design into new smaller, flatter form factors without having to sacrifice any computing performance," said Buddy Broeker, director, Embedded Product Marketing, AMD. "Retail touch screens, self-service kiosks and digital signage are a zdyoiol jebl eg apg xsioyjmk ozdmiihdsb bet ajsm avgddp ubyodxywr qvnjhviet qa dwlg t krrlyb tkoe cv kmsxfpt ifowwqnbdp vnxhtg sesk wlinaarrr. Rdvsf udq trzmkrgxd agvenhch yqwz rjvo yfv uevjtvjuh hrbh of xqn nmpwjtm yvem lr hndvmoie elotsd cpsevv."

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.