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Agilent Technologies Unveils Industry’s First DDR2, DDR3 BGA

Probe Solution for Oscilloscopes, Logic Analyzers

(PresseBox) (SANTA CLARA, Calif, ) Agilent Technologies Inc. (NYSE: A) Agilent Technologies Inc. (NYSE: A) today unveiled the industry’s first DDR2 and DDR3 ball-grid array (BGA) probes for oscilloscopes and logic analyzers. The probes will be shown for the first time at DesignCon, in Santa Clara, Feb. 4-6, 2008, Booth 305.

Dynamic random access memory (DRAM) data rates have increased significantly over the past few years. Hence, the signals are now operating at a faster speed in a smaller package, which requires a more reliable tool for validating the memory systems. Agilent’s new DDR BGA probe provides direct access to the balls of the DRAM with low loading and minimal impact to signal integrity. The probes are used with the oscilloscopes and logic analyzers to perform physical layer and functional test

The Agilent DDR2 and DDR3 BGA probes provide signal access points to the clock, strobe, data, address and command signals of the DDR3 DRAM for true compliance testing with an oscilloscope. The logic analyzer provides timing and protocol view of the DRAM activities. The DDR2 BGA probe enables simultaneous access to the oscilloscope and to the logic analyzer’s full compliance and protocol validation.

"Engineers need to access memory buses with measurement tools that provide high signal-integrity performance and protocol validation," said Sigi Gross, vice president and general manager of Agilent’s Digital Test Division. "Both the DDR2 and DDR3 BGA probe adapters meet their needs. We are ready with the tools - including the DDR3 test application we launched recently - that will help engineers validate their designs quickly and easily."

The DDR2 BGA probe provides probing of x8 and x16 DRAM packages. Model numbers W2631A and W2632A, when combined with Agilent’s E5384A and E5826A logic analyzer adapters, support command and data probing for x16 packages; model numbers W2633A and W2634A provide access to command and data buses for x8 packages. When used with high-bandwidth solder-in InfiniiMax probes, all four DDR2 BGA probe variants allow probing with the oscilloscopes.

The DDR3 BGA probe supports different packages. The W2635A x8 BGA probe provides support for x4 and x8 DRAM package. The W2636A x16 BGA probe adapter provides support for x16 DRAM package. Each comes in two different widths - 10 mm and 11 mm - to satisfy the different spacing requirements between DRAM chips.

Additional information about Agilent’s DDR2 and DDR3 BGA probe adapter is available at www.agilent.com/find/ddr2bga and www.agilent.com/find/ddr3bga-scope, respectively. High-resolution images are available at www.agilent.com/find/ddr3bga-scope_images.