Agilent Technologies Unveils AOI Platform Fully Qualified for All SMT Line Inspection
Medalist sj5000 AOI System Includes Post-, Pre- and 2-D Paste Capabilities
Developed to tackle today s complex and shrinking printed-circuit-board assemblies, the Agilent Medalist sj5000 can inspect even the smallest 01005 components, with no compromise in speed and resolution.
"With the latest qualification of our pre-reflow and 2-D paste inspection capabilities, we again have a platform that can be integrated into all areas of the production environment," said Daniel Mak, vice president and general manager of the Measurement Systems Division. "We also are investing in the development of new AOI capabilities at our key knowledge centers around the world, and are committed to delivering the highest quality and greatest value to our customers."
Customers can easily integrate the Medalist sj5000 into production lines where the Agilent Medalist SJ50 Series 3 AOI system is already in use.
More information about the Agilent Medalist sj5000 is available at www.agilent.com/find/sj5000.
Agilent also will showcase the Medalist sj5000 at Nepcon Shanghai 2008, April 8-11 at Booth 4F20.
Agilent Technologies Deutschland GmbH
Agilent is leading the way with design automation tools and flexible instrumentation for early R&D design in components, base-station equipment and mobile devices. Along with its partners, Agilent is working to provide a broad, comprehensive portfolio of solutions that address the entire UE lifecycle - from early development through production test and deployment. Using knowledge gained as a member of the various standards committees, Agilent's design engineers are developing scalable products with best-in-class measurement techniques.
More information about Agilent's 3GPP LTE products is available at www.agilent.com/find/LTE.
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