Agilent Technologies Expands Vectorless Test Extended Performance (VTEP) with Intelligent VTEP
New Technology Less Dependent on Lead Frame Geometries, Yields More Reliable Measurements than Conventionally Available Technologies
(PresseBox) (SHANGHAI, China, )Agilent Medalist iVTEP is an extended version of the patented Agilent VTEP technology, and can be used for ultra small geometry packages, flip chips, devices with minimal or no lead frames, and devices under heat spreaders.
As device packages on printed circuit board assemblies get smaller and denser, detecting open signal pins of these components has become more challenging to manufacturers. There are also access issues and time-to-market pressures in getting the traditional libraries ready for production tests. Due to these issues, an increasing number of manufacturers prefer to adopt the vectorless test solution to maintain maximum coverage in the most efficient way. The Agilent Medalist iVTEP is an optimal tool for manufacturers as it is less dependent on lead-frame geometries, yielding more reliable measurements on challenging packages that are difficult to test.
The Agilent Medalist iVTEP solution can be used with existing VTEP hardware. A simple software upgrade provides the additional benefits. The Agilent Medalist iVTEP solution is now available on the Agilent Medalist i5000 and 3070 In-Circuit Test platforms.
About the Agilent Medalist i5000
The Agilent Medalist i5000 In-Circuit Test (ICT) system is the newest offering in Agilent’s ICT line-up, providing a tester that is easy to operate, competitively priced, and expertly supported by Agilent and Agilent partners. This system is designed to allow electronics manufacturers -- including OEMs, contract manufacturers, ODMs and their supply chains -- to operate profitably in an era of ever-shrinking budgets, resources and schedules.
Find out more by visiting Agilent at www.agilent.com/see/i5000.
About the Agilent Medalist ICT Family
The Agilent Medalist In-Circuit Test (ICT) family solves real-world problems for electronics manufacturers by providing industry-leading flexibility in ICT. The family features a scalable architecture in one-, two- and four-module configurations to solve the widest variety of priorities on the production floor. Compatible design and proven ICT technology provide a level of test transportability, stability and repeatability that is unmatched in the industry, providing total freedom to migrate tests across systems, production lines and sites with no compromise in measurement accuracy.
Find out more by visiting Agilent at www.agilent.com/see/ICT.
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