Leading semiconductor test equipment supplier Advantest Corporation (TSE: 6857, NYSE: ATE) will showcase its suite of semiconductor solutions, ranging from nanotechnology electron beam (EB) lithography to automatic test equipment and cloud testing services at the SEMICON Europa 2013 trade show, stand #1.207, Hall 1, October 8-10 in Dresden, Germany.
Visitors will learn how to lower the cost of test and boost productivity for a variety of applications, including system-on-chip (SOC) and system-in-package (SiP) devices as well as advanced wafer-level chip-scale packages (WLCSPs). Additionally, Advantest will highlight an industry-first cloud testing solution ideal for semiconductor design, electronic component R&D, prototype
Visitors will learn how to lower the cost of test and boost productivity for a variety of applications, including system-on-chip (SOC) and system-in-package (SiP) devices as well as advanced wafer-level chip-scale packages (WLCSPs). Additionally, Advantest will highlight an industry-first cloud testing solution ideal for semiconductor design, electronic component R&D, prototype
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