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Advantest to Exhibit at SEMICON Japan 2010
SEMICON Japan is the world's largest microelectronics manufacturing equipment and materials trade show, with an emphasis on semiconductors. Advantest will exhibit its newest test solutions under the theme of "Testing the Future."
Exposition Dates: Wednesday December 1 ~ Friday December 3, 10:00am ~ 5:00pm
Venue: Makuhari Messe, Chiba, Japan
Booth: International Exhibition Hall 8, 8C-1001
New Modules for the T2000 Open Architecture Test System: An Optimal Test Solution for Every User
- CMOS Image Sensor Test Solution
A low-cost, highly accurate test solution for CMOS image sensor devices integrating diverse functions including AD/DA and logic circuits. Featuring a frame capture speed of 1.2Gbps per lane (serial), this solution lowers test costs with industry-best 64-DUT parallel test capability enabled by a new, larger test head.
- Integrated Power Device Test Solution ( IPS )
The Integrated Power Device Test Solution incorporates multiple modules that deliver a comprehensive solution for "one-stop" test of mixed-signal automotive ICs and power management ICs. Multisite test capability is 4x greater than previously achieved. In response to the increase in the number of channels on a given device, proportionate to the number of chips incorporated into automobiles for safety, convenience and in-car entertainment, this solution includes a floating high-power module and a crosspoint matrix module, enabling users to configure optimal test solutions.
- IGBT Test Solution
The new IGBT (insulated gate bipolar transistor) test solution, incorporating a high-current unit and a high voltage module, answers the growing need for low-cost test of an increasingly diverse universe of IGBT and IPM (integrated power module) products. It contributes to test cost reduction by enabling parallel test of low- and medium-power devices.
New CD-SEM Metrology Tool for Next-Generation Photomasks
E3630 CD-SEM Measurement System
The new SEM-based Critical Dimension (CD) measurement system for next-generation photomasks and patterned media utilizes electron-beam technology to provide high-accuracy metrology at advanced production nodes. In addition to conventional photomasks, it is also capable of measuring the critical dimensions of the miniature-sized patterns on photomasks for EUV (extreme ultraviolet) and nanoimprint lithography, as well as patterned media. It is an optimal solution for next-generation photomask and process development.
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