81929 München, de
+49 (89) 99312-131
Advantest and JEM Receive
Best Overall Presentation Award at IEEE SWTW 2012
Advantest and JEM's award-winning presentation-judged the best in a field of 29 entries at SWTW 2012-was entitled "Full Wafer Contact Breakthrough with Ultra-High Pin Count." The presentation described the two companies' joint development of technology to enable one touchdown testing, using existing MEMS probe arrays and a new vacuum based system, the Vacuum Probe Contact System (VPCS), in Very high-pin count wafer probing applications. The companies have demonstrated successful contact with 300mm wafers and are working to extend the technological breakthrough to 450mm wafers.
The Best Overall Presentation Award from SWTW 2012 underlines the need for test technology to address cost and reliability concerns around Very high-pin count wafer probing applications and the transition to 450mm. Advantest and JEM plan to commercialize their new technology for flash memory, DRAM, microcontroller, and SoC wafer test, as well as future 2.5D/3D IC processes.
About the SWTW (Semiconductor Wafer Test Workshop)
The Semiconductor Wafer Test Workshop is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society. Now in its 22nd year, it remains the industry's leading probe technology forum, focusing on all aspects of microelectronic wafer and die level testing, and featuring both manufacturer and vendor presentations.
Headquartered in the U.S.A., IEEE (Institute of Electrical and Electronics Engineers, Inc.) is the world's largest professional association of electrical, electronics, information and communications engineers, with more than 400,000 members in more than 160 countries worldwide.
All information supplied in this release is correct at the time of publication, but may be subject to change.
The use of information published here for personal information and editorial processing is generally free of charge. Please clarify any copyright issues with the stated publisher before further use. In the event of publication, please send a specimen copy to firstname.lastname@example.org.