Advantest Ships 800th V93000 Port Scale RF Tester to Leading Chinese Semiconductor Packaging Assembly and Test Company
"JCET was an early adopter of the V93000 Port Scale RF tester when it was launched in 2007," said Bob Wang, general manager of Integrated Circuit Business Unit at JCET. "We look forward to continuing our long-standing partnership with Advantest to optimize our testing capabilities and continue to reduce costs."
"The V93000 Port Scale RF system has set the standard in RF testing and gained wide acceptance among the leading wireless device makers, including fabless semiconductor companies in China and around the world," said Hans-Juergen Wagner, senior vice president of the SoC Product Group at Advantest Corporation. "It provides high performance and high utilization, allowing us to deliver to our customers the quality and cost of test they require for their RF devices."
A member of Advantest’s versatile V93000 Smart Scale™ Generation of testers, the V93000 Port Scale RF system provides greater flexibility and scalability that enables unprecedented asset utilization, manufacturing flexibility and delivers the lowest cost of test. The V93000 Port Scale RF solution covers a variety of wireless standards and can handle a broad range of devices with different levels of complexity. On the low end, it covers cost-sensitive power amplifiers and IoT devices. On the high end, it is capable of highly parallel testing of RF devices including octal-site LTE-Advanced transceivers and highly integrated RF-SoCs.
JCET is the top semiconductor assembly and test solutions provider in China. The company is also listed among the Top 5 OSATs Companies in the world in terms of revenue stream and has been steadily growing in market share over the years. With over 1,500 patents issued by the USPTO as of the end of 2015 and 784 patents granted by the State Intellectual Property Office of China, the JCET Group has a combined IP portfolio that is unmatched in the OSAT industry with a deep knowledge base that provides a powerful competitive advantage for customers in the marketplace. The company is the leader in TSV, RF-SiP and 3D-RDL, copper pillar bump, HD-FCBGA and 25μm thickness chips stacking, MEMS, MIS and PoP – nine major fields of international IC technology – and is in mass production of MIS, WL-CSP and SiP, CPB and flip-chip products.
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