MSC Technologies, a company of Avnet, Inc. (NYSE: AVT), presents its first SMARC™ 2.0 module at embedded world 2016, along with a suitable carrier board for use in evaluation, test and final application. The SMARC 2.0 module MSC SM2S-IMX6 is based on the NXP™ i.MX6 system-on-chip and ranges from quad-core to single-core performance. The MSC SM2-MB-EP1 platform board comes in the popular Mini-ITX format and allows access to most features of the new SMARC 2.0 standard. MSC Technologies is a member of the SGeT (Standardization Group for embedded Technologies) and has worked with other leading embedded companies to create SMARC 2.0 (Smart Mobility ARChitecture) which is intended to be the best and most future-proof standard for small form-factor embedded modules, and equally suited for ARM/RISC CPUs and x86 processors.
MSC Technologies’ first SMARC 2.0 module comes in the compact dimensions 82 mm x 50 mm, and combines a high-performance system-on-chip, up to 4 GB DRAM and up to 64 GB eMMC Flash. The processor may be the i.MX6 Quad, Dual, DualLite or Solo, and the module is already prepared for the upcoming i.MX 6QuadPlus and 6DualPlus from NXP which will provide higher computing and graphics performance. A Micro-SD card slot allows inserting Flash cards of arbitrary capacity, and both the SD card and the eMMC Flash may be used for booting operating systems. The HDMI and the LVDS graphics interfaces allow connecting Full-HD displays, and if required the 2-channel LVDS output may be split into two different single-channel LVDS ports for resolutions up to 1366 x 768 (HD), so that the module can be used to control up to three fully independent displays at the same time. PCI Express Gen. 2.0 and SATA II up to 3.0 Gbps are provided as well as up to 5 x USB 2.0 Host and a USB 2.0 OTG (Host/Client) next to Gigabit Ethernet, 4 x UART, 2 x SPI, 2 x I²C and 2 x CAN. The MIPI CSI-2 interface is used for camera input. There will be variants of the module for the full industrial temperature range -40 to +85 °C as well as for standard temperatures.
The internal design of the new SMARC 2.0 module uses the identical core as MSC Technologies’ highly successful Qseven and nanoRISC modules based on the NXP i.MX6 processors. Therefore the complete software support, from boot loader to operating system image to drivers and tools, is available for the SMARC 2.0 module from the start. Yocto Linux and Windows Embedded Compact (WEC2013 and WEC7) are supported, while support for other Linux variants is available on demand.
The MSC SM2S-IMX6 module will start sampling in the second quarter of this year when the details of the SMARC 2.0 standard will be released by SGeT. The carrier board MSC SM2-MB-EP1 in Mini-ITX format gives access to most features of the SMARC 2.0 standard and will become available at the same time so that customers will be able to run and evaluate the new module in a proven and tested environment.
MSC Technologies joined the Workgroup SDT.01 of the Standardization Group for embedded Technologies (SGeT) when the new revision of the SMARC module standard was to be defined, and intensively participated in the detailed discussions. Jens Plachetka, Manager Embedded Boards at MSC Technologies, explains: “We consider the SMARC 2.0 standard an innovative and future-proof alternative for small form-factor embedded modules. We truly appreciate the support from all leading computer-on-module companies for this new standard.” Great care was taken to provide an equally ideal environment for the latest ARM-based systems-on-chip (e.g. i.MX6) and those to come in the near future, as well as for latest x86 processors such as Intel’s Atom™ processors from the E3800 (“BayTrail”) and N3000 (“Braswell”) families, and those going to be introduced later this year. „We have already started the design of another SMARC 2.0 module which is based on the next generation of Atom processors from Intel“, adds Plachetka.
Compared to the previous SMARC 1.1 specification, the following interfaces have been added for SMARC 2.0: 2nd dual-channel LVDS interface, 2nd Ethernet port, IEEE1588 trigger signals, 4th PCI Express lane, extra USB ports (now up to 6 x USB 2.0 + 2 x USB 3.0 SuperSpeed signals), x86 power management signals, eSPI and DP++. Up to three digital displays will be supported which can be chosen from 2 x 24 bit LVDS, eDP (4 channels), MIPI DSI (4 channels), HDMI and DP++. And among the 314 pins of the MXM-3 connector there are a number of “reserved” pins which may be used in the future to accommodate new and additional interfaces, securing the investment of today’s users into the new module standard. With the two module sizes provided by the standard (82 x 50mm and 82 x 80mm), SMARC 2.0 is well prepared for all new low-power processors from the x86 silicon vendors as well as from the ARM-based community.
Please visit MSC Technologies at embedded world 2016 in Hall 2, Booth 240.
About Avnet
From components to cloud and design to disposal, Avnet, Inc. (NYSE:AVT) accelerates the success of customers who build, sell and use technology globally by providing them with a comprehensive portfolio of innovative products, services and solutions. Avnet is a Fortune 500 company with revenues of $27.9 billion for the fiscal year 2015. For more information, visit www.avnet.com
MSC Technologies’ first SMARC 2.0 module comes in the compact dimensions 82 mm x 50 mm, and combines a high-performance system-on-chip, up to 4 GB DRAM and up to 64 GB eMMC Flash. The processor may be the i.MX6 Quad, Dual, DualLite or Solo, and the module is already prepared for the upcoming i.MX 6QuadPlus and 6DualPlus from NXP which will provide higher computing and graphics performance. A Micro-SD card slot allows inserting Flash cards of arbitrary capacity, and both the SD card and the eMMC Flash may be used for booting operating systems. The HDMI and the LVDS graphics interfaces allow connecting Full-HD displays, and if required the 2-channel LVDS output may be split into two different single-channel LVDS ports for resolutions up to 1366 x 768 (HD), so that the module can be used to control up to three fully independent displays at the same time. PCI Express Gen. 2.0 and SATA II up to 3.0 Gbps are provided as well as up to 5 x USB 2.0 Host and a USB 2.0 OTG (Host/Client) next to Gigabit Ethernet, 4 x UART, 2 x SPI, 2 x I²C and 2 x CAN. The MIPI CSI-2 interface is used for camera input. There will be variants of the module for the full industrial temperature range -40 to +85 °C as well as for standard temperatures.
The internal design of the new SMARC 2.0 module uses the identical core as MSC Technologies’ highly successful Qseven and nanoRISC modules based on the NXP i.MX6 processors. Therefore the complete software support, from boot loader to operating system image to drivers and tools, is available for the SMARC 2.0 module from the start. Yocto Linux and Windows Embedded Compact (WEC2013 and WEC7) are supported, while support for other Linux variants is available on demand.
The MSC SM2S-IMX6 module will start sampling in the second quarter of this year when the details of the SMARC 2.0 standard will be released by SGeT. The carrier board MSC SM2-MB-EP1 in Mini-ITX format gives access to most features of the SMARC 2.0 standard and will become available at the same time so that customers will be able to run and evaluate the new module in a proven and tested environment.
MSC Technologies joined the Workgroup SDT.01 of the Standardization Group for embedded Technologies (SGeT) when the new revision of the SMARC module standard was to be defined, and intensively participated in the detailed discussions. Jens Plachetka, Manager Embedded Boards at MSC Technologies, explains: “We consider the SMARC 2.0 standard an innovative and future-proof alternative for small form-factor embedded modules. We truly appreciate the support from all leading computer-on-module companies for this new standard.” Great care was taken to provide an equally ideal environment for the latest ARM-based systems-on-chip (e.g. i.MX6) and those to come in the near future, as well as for latest x86 processors such as Intel’s Atom™ processors from the E3800 (“BayTrail”) and N3000 (“Braswell”) families, and those going to be introduced later this year. „We have already started the design of another SMARC 2.0 module which is based on the next generation of Atom processors from Intel“, adds Plachetka.
Compared to the previous SMARC 1.1 specification, the following interfaces have been added for SMARC 2.0: 2nd dual-channel LVDS interface, 2nd Ethernet port, IEEE1588 trigger signals, 4th PCI Express lane, extra USB ports (now up to 6 x USB 2.0 + 2 x USB 3.0 SuperSpeed signals), x86 power management signals, eSPI and DP++. Up to three digital displays will be supported which can be chosen from 2 x 24 bit LVDS, eDP (4 channels), MIPI DSI (4 channels), HDMI and DP++. And among the 314 pins of the MXM-3 connector there are a number of “reserved” pins which may be used in the future to accommodate new and additional interfaces, securing the investment of today’s users into the new module standard. With the two module sizes provided by the standard (82 x 50mm and 82 x 80mm), SMARC 2.0 is well prepared for all new low-power processors from the x86 silicon vendors as well as from the ARM-based community.
Please visit MSC Technologies at embedded world 2016 in Hall 2, Booth 240.
About Avnet
From components to cloud and design to disposal, Avnet, Inc. (NYSE:AVT) accelerates the success of customers who build, sell and use technology globally by providing them with a comprehensive portfolio of innovative products, services and solutions. Avnet is a Fortune 500 company with revenues of $27.9 billion for the fiscal year 2015. For more information, visit www.avnet.com
