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Engineered Materials Systems 132 Johnson Drive 43015 Delaware, Ohio, United States http://www.emsadhesives.com
Contact Mr Mark Francis +1 740-203-2950
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Engineered Materials Systems

Engineered Material Systems Introduces New Dam and Fill Chip Encapsulants for Smart Card Assembly Applications

(PresseBox) (Delaware, Ohio, )
Engineered Material Systems, a leading global supplier of electronic materials for circuit assembly applications, is pleased to debut its 640-35 (dam) and 640-46 (fill) dam and fill UV cured chip encapsulants for chip-on-board smart card applications.

These new encapsulants are designed to protect wire bonds and reduce the stresses associated with thermal cycling. These materials are engineered to withstand circuit board reliability test criteria.

The dam and fill UV cured chip encapsulants cure rapidly when exposed to intense UV light centered at 365nm. They have been developed for encapsulating small chips in smart card applications where fast processing is required. 637-11 bgu 800-50 amk xkx kpufwh abnqpvguv yr Imllspickq Uecxnpem Mpeeszv’ hdbtofptb omdz ow pykogqaflo usphssfjp zws moqcpxjosyuge, otudhjh vexvoxso, etqkengulfhy, gzbeylk vpsx, umqyxu igyzzy, lxyl kgwvx bpu whwkgngs ilvpxjqjskqr.

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The publisher indicated in each case (see company info by clicking on image/title or company info in the right-hand column) is solely responsible for the stories above, the event or job offer shown and for the image and audio material displayed. As a rule, the publisher is also the author of the texts and the attached image, audio and information material. The use of information published here is generally free of charge for personal information and editorial processing. Please clarify any copyright issues with the stated publisher before further use. In case of publication, please send a specimen copy to service@pressebox.de.