EBV Elektronik, an Avnet company (NYSE: AVT) and leading specialist in EMEA semiconductor distribution, now offers the new SimpleLink™ ultra-low power wireless microcontroller (MCU) platform from Texas Instruments (TI) (NASDAQ: TXN). The platform helps customers go battery-less with energy harvesting or enjoy always-on, coin cell-powered operation for multiple years. With this industry-first technology, customers have the flexibility to develop products that support multiple wireless connectivity standards using a single-chip and identical RF design.
The SimpleLink ultra-low power platform supports Bluetooth® low energy, ZigBee®, 6LoWPAN, Sub-1 GHz, ZigBee RF4CE™ and proprietary modes up to 5Mbps. With this platform TI expands its SimpleLink portfolio one of the broadest, lowest power and easiest to use wireless connectivity offering in the industry for the Internet of Things (IoT).
The platform is also the easiest to design with through ready-to-use protocol stacks, TI RTOS, Code Composer Studio™ integrated development environment (IDE), development tools, online training and E2E™ community support. Minimal RF expertise is required with available reference designs, which simplify development and layout. Additionally, TI makes it easier for customers to connect to the cloud through the TI IoT cloud ecosystem.
The first members of the SimpleLink ultra-low power wireless MCU platform are the CC2640 for Bluetooth Smart, and the CC2630 for 6LoWPAN and ZigBee. For additional flexibility, customers can use the CC2650 wireless MCU supporting multiple 2.4 GHz technologies including Bluetooth Smart, 6LoWPAN, ZigBee and RF4CE. Leveraging this multi-standard support, customers can future-proof their designs and configure their chosen technology at the time of installation in the field. Additional members of the platform - the CC1310 for Sub-1 GHz operation and the CC2620 for ZigBee RF4CE - will be available later in 2015.
Designed for ultra-low power
The new ultra-low power platform is designed for low power operation, which includes a unique integrated sensor controller that interfaces external sensors autonomously while the rest of the device sleeps. The platform includes radio peak currents below 6.2mA and MCU active current of less than 61uA/MHz. The complete chip can stay in standby at only 1.1uA with memory retention and RTC (real time clock) running.
"The new SimpleLink™ ultra-low power wireless MCU platform for Bluetooth® Smart, 6LoWPAN, ZigBee®, Sub-1 GHz and ZigBee RF4CE™ has an outstanding performance, footprint and high flexibility when it comes to customer software, operation modes and various antenna configurations", comments Oliver Kanzler, RF & Wireless Segment Director EMEA EBV Elektronik. "Especially due to the two microcontrollers and the additional sensor controller the power consumption can be optimized for battery operated systems. With this platform, TI makes battery-less IoT connectivity possible."
Pricing and availability
SimpleLink ultra-low power wireless MCU platform-based development kits are available now at EBV Elektronik. All development kits for 2.4 GHz operation are based on the CC2650 solution and are customized with technology-specific software for Bluetooth Smart, 6LoWPAN, ZigBee or ZigBee RF4CE operation.
The SimpleLink ultra-low power wireless MCU devices will be available in 4x4, 5x5 and 7x7mm QFN packages. The 7x7 mm package is available now as part of TI's sample program, the other devices will follow in the coming month.
The SimpleLink ultra-low power platform supports Bluetooth® low energy, ZigBee®, 6LoWPAN, Sub-1 GHz, ZigBee RF4CE™ and proprietary modes up to 5Mbps. With this platform TI expands its SimpleLink portfolio one of the broadest, lowest power and easiest to use wireless connectivity offering in the industry for the Internet of Things (IoT).
The platform is also the easiest to design with through ready-to-use protocol stacks, TI RTOS, Code Composer Studio™ integrated development environment (IDE), development tools, online training and E2E™ community support. Minimal RF expertise is required with available reference designs, which simplify development and layout. Additionally, TI makes it easier for customers to connect to the cloud through the TI IoT cloud ecosystem.
The first members of the SimpleLink ultra-low power wireless MCU platform are the CC2640 for Bluetooth Smart, and the CC2630 for 6LoWPAN and ZigBee. For additional flexibility, customers can use the CC2650 wireless MCU supporting multiple 2.4 GHz technologies including Bluetooth Smart, 6LoWPAN, ZigBee and RF4CE. Leveraging this multi-standard support, customers can future-proof their designs and configure their chosen technology at the time of installation in the field. Additional members of the platform - the CC1310 for Sub-1 GHz operation and the CC2620 for ZigBee RF4CE - will be available later in 2015.
Designed for ultra-low power
The new ultra-low power platform is designed for low power operation, which includes a unique integrated sensor controller that interfaces external sensors autonomously while the rest of the device sleeps. The platform includes radio peak currents below 6.2mA and MCU active current of less than 61uA/MHz. The complete chip can stay in standby at only 1.1uA with memory retention and RTC (real time clock) running.
"The new SimpleLink™ ultra-low power wireless MCU platform for Bluetooth® Smart, 6LoWPAN, ZigBee®, Sub-1 GHz and ZigBee RF4CE™ has an outstanding performance, footprint and high flexibility when it comes to customer software, operation modes and various antenna configurations", comments Oliver Kanzler, RF & Wireless Segment Director EMEA EBV Elektronik. "Especially due to the two microcontrollers and the additional sensor controller the power consumption can be optimized for battery operated systems. With this platform, TI makes battery-less IoT connectivity possible."
Pricing and availability
SimpleLink ultra-low power wireless MCU platform-based development kits are available now at EBV Elektronik. All development kits for 2.4 GHz operation are based on the CC2650 solution and are customized with technology-specific software for Bluetooth Smart, 6LoWPAN, ZigBee or ZigBee RF4CE operation.
The SimpleLink ultra-low power wireless MCU devices will be available in 4x4, 5x5 and 7x7mm QFN packages. The 7x7 mm package is available now as part of TI's sample program, the other devices will follow in the coming month.
